Description:
- Proffesional repair tool set for mobile phone CPU disassemble.
- One handle and 10 pcs blades in different shapes.
- Good for BGA repair,dismantling phone IC chip.
- It can be used to separate the welding spot.
Specification:
- Material: Alloy steel,Metal
- Handle length: 132 mm
- Handle diameter: 6 mm
- Weight: 28 g
What’s in the Package:
- 27 x IC Chip Repair Blades
- 1 x Handle
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